Standard

NEK IEC PAS 62050:2004

Nov 2004 Withdrawn

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Language English

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Abstract

The Board Level Drop Test Method is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface mounted components while duplicating the failure modes normally observed during product level test. The purpose of this document is to prescribe a standardized test method and reporting procedure.

Document information

Standard from NEK
Published: 10 November 2004
Withdrawn: 18 August 2009
Edition: 1.0
Version: 1
Document type: PAS
ISBN:

ICS 31.080.01
National Committee NEK/NK47

Product Relations

Replaced by: NEK IEC 60749-37:2008
Adopted from: IEC PAS 62050:2004

NEK IEC PAS 62050:2004

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Abstract

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Abstract

Document information

Product Relations