Standard

NEK IEC PAS 60191-6-19:2008

Jan 2008 Withdrawn

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Abstract

This PAS stipulates the package warpage criteria and the package warpage measurement methods at elevated temperature for BGA, FBGA, and FLGA.

Document information

Standard from NEK
Published: 22 January 2008
Withdrawn: 25 February 2010
Edition: 1.0
Version: 1
Document type: PAS
ISBN:

ICS 31.080.01
National Committee TC 47/SC 47D

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Adopted from: CISPR 36:2020+AMD1:2023 CSV
Adopted from: CISPR 36:2020 ED1
Replaced by: NEK IEC 60191-6-19:2010
Adopted from: IEC PAS 60191-6-19:2008

NEK IEC PAS 60191-6-19:2008

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Abstract

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Abstract

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