Standard

NEK IEC 63011-2:2018

Nov 2018 Published

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Language English

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Abstract

IEC 63011-2:2018 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die-to-die alignment is used in the die stacking.

Document information

Standard from NEK
Published: 28 November 2018
Edition: 1.0
Version: 1
Document type: NAT
Pages
ISBN:

ICS 31.200
National Committee NEK/NK47

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Adopted from: IEC 62561-3:2023 RLV
Adopted from: IEC 62561-3:2023 ED3
Adopted from: IEC 63011-2:2018, 0

NEK IEC 63011-2:2018

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Abstract

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Abstract

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