Standard

NEK IEC 62258-6:2006

Aug 2006 Published

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Language English

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Abstract

Determines the information required to facilitate the use of thermal data and models for simulation of the thermal behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. Intends to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2

Document information

Standard from NEK
Published: 28 August 2006
Edition: 1.0
Version: 1
Document type: NAT
ISBN:

ICS 31.080.99
National Committee NEK/NK47

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Adopted from: IEC 62258-6:2006

NEK IEC 62258-6:2006

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Abstract

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Abstract

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