Standard

NEK IEC 61192-4:2002

Nov 2002 Withdrawn

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Abstract

Specifies general requirements for workmanship in terminal soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally terminals or mixed assemblies that include surface-mounting or other related assembly technologies, for example through-hole, wires.

Document information

Standard from NEK
Published: 29 November 2002
Withdrawn: 30 November 2018
Edition: 1.0
Version: 1
Document type: NAT
ISBN:

ICS 31.190
National Committee NEK/NK91

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Adopted from: IEC 60684-3-211:2002 ED2
Adopted from: IEC 61192-4:2002

NEK IEC 61192-4:2002

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Abstract

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Abstract

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