Standard

NEK IEC 61192-3:2002

Withdrawn

Corrigendums and amendments are bought separately.

Language
Services

Abstract

Specifies general requirements for workmanship in through-hole mount soldered assemblies on organic substrates, on printed boards, and on similar laminates attached to the surface(s) of inorganic substrates. It applies to assemblies that are totally through-hole or mixed assemblies that include surface-mounting or other related assembly technologies, for example, terminals, wires.

Document information

  • Standard from NEK
  • Published:
  • Withdrawn:
  • Edition: 1.0
  • Version: 1
  • Document type: NAT
  • Pages
  • ICS 31.190
  • National Committee NEK/NK91

Product Relations