Redline

NEK IEC 61191-1:2018 RLV

Sep 2018 Published

Note: This standard has a new edition: NEK IEC 61191-1:2018

Corrigendums and amendments are bought separately.

Language English

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Abstract

IEC 61191-1:2018 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 61191-1:2018 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes. This edition includes the following significant technical changes with respect to the previous edition: - the requirements have been updated to be compliant with the acceptance criteria in IPC-A-610F; - the term "assembly drawing" has been changed to "assembly documentation" throughout; - references to IEC standards have been corrected; - Clause 9 was completely rewritten; - Annex B was removed because there are already procedures for circuit board assemblies.

Document information

Redline from NEK
Published: 14 September 2018
Edition: 3.0
Version: 1
Document type: NAT
Pages
ISBN:

ICS 31.190
ICS 31.240
National Committee NEK/NK91

Product Relations

Adopted from: IEC 61191-1:2018 RLV, 0

NEK IEC 61191-1:2018 RLV

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