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Standard

NEK IEC 61189-3-302:2025

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Abstract

IEC 61189-3-302:2025 describes a method for the detection of plating defects in unpopulated circuit boards using computed tomography (CT).This document is applicable to non-destructive testing of metallized holes.

Document information

  • Standard from NEK
  • Published:
  • Edition: 1.0
  • Version: 1
  • Document type: NAT
  • ICS 31.180

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  • Adopted from: IEC 61189-3-302:2025