Standard

NEK IEC 61188-5-1:2002

Jul 2002 Withdrawn

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Language English

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Abstract

Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.

Document information

Standard from NEK
Published: 12 July 2002
Withdrawn: 24 February 2021
Edition: 1.0
Version: 1
Document type: NAT
ISBN:

ICS 31.180
ICS 31.190
National Committee NEK/NK91

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Replaced by: NEK IEC 61188-6-1:2021
Adopted from: IEC 61188-5-1:2002

NEK IEC 61188-5-1:2002

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Abstract

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Abstract

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