Standard

NEK IEC 60748-20:1988

Jun 1988 Published

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Language English

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Abstract

Applies to film integrated circuits and to hybrid film integrated circuits both passive and active. Applies also to partly-completed F and HFICs supplied to customers for subsequent processing as well as to chip carrier circuits having more than one chip, provided that they have been interconnected by film interconnection techniques. This specification defines the quality assessment procedures and the methods for electrical, climatic, mechanical and endurance tests. It outlines the requirements which shall be applied to the release of circuits using either qualification approval procedures or capability approval procedures.

Document information

Standard from NEK
Published: 30 June 1988
Edition: 1.0
Version: 1
Document type: NAT
Pages
ISBN:

ICS 31.200
National Committee TC 47/SC 47A

NEK IEC 60748-20:1988

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Abstract

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Access to standards for the entire organization

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Abstract

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