Standard

NEK EN IEC 61189-2-808:2024

Jun 2024 Published

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Abstract

IEC 61189-2-808:2024 describes the thermal transient method to characterize the thermal resistance of an assembly consisting of a heat source (e.g. power device), an attachment material (e.g. solder) and a dielectric layer with electrode. This method is suitable to determine the thermal resistance of materials and assembly methods as well as to optimize the thermal flux to a heat sink.NOTE: This method is not intended to measure and specify the value of the thermal resistance of a dielectric material. For that purpose, other standards exist. Examples are given in Annex A.

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Standard from NEK
Published: 5 June 2024
Edition: 2024-05
Version: 1
Document type: NAT
ISBN:

ICS 31.180
National Committee NEK/NK91

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Abstract

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