Standard

NEK EN 60749-19:2003

Apr 2003 Published

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Abstract

Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates generally only applicable to cavity packages or as a process monitor.

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Standard from NEK
Published: 17 April 2003
Edition: 1
Version: 1
Document type: NAT
ISBN:

ICS 31.080.01
National Committee NEK/NK47

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Adopted from: EN 60749-19:2003 , 0

NEK EN 60749-19:2003

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Version history Related corrigendum and amendments (1)

NEK EN 60749-19:2003/A1:2010

Abstract

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