Standard

JEDEC JESD51-34

Published

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Abstract

This standard specifies a method for the stationary and transient thermal characterization of semiconductor devices with one or more heat sources based on the linear superposition principle.  The thermal metric presented herein covers multi-source as well as single-source devices, the latter being just a special case of the former. Nevertheless for steady-state characterization of single heat-source devices the reader is referred to JEDEC documents in the JESD51 series (i.e. JESD51-1 through JESD51-14) specifically dedicated to single-chip thermal metrics. Throughout this document the terms “Multi-Chip Package” (MCP) and “Multi-Source Device” will be used synonymously, referring to any semiconductor device in which heat is dissipated in more than one distinct region. This can be several heat sources on a single chip or several chips in a package or any combination thereof.

Document information

  • Standard from JEDEC_AC
  • Published:
  • Version: 0
  • Document type: IS