Standard

JEDEC JEP196

Published

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Abstract

This white paper presents an industry-wide survey on the relevance of industry-aligned D2D CDM targets and the currently used targets for D2D interfaces. The survey results emphasize the need for a common roadmap. The three main aspects of the paper are the assessment of the status of electrostatic discharge (ESD) control of the process steps with ESD exposure for D2D interfaces, the stress test approach, and the roadmap of the target values. These recommendations outline the tasks for the industry to get prepared for the use of high-density D2D interfaces in the years to come. The white paper affects IP design, chiplet design, foundry, and the outsourced semiconductor assembly and test (OSAT) industry as well as EDA vendors.

Document information

  • Standard from JEDEC_AC
  • Published:
  • Version: 0
  • Document type: IS