Standard

IEC PAS 62190:2000 ED1

Nov 2000 Replaced

Corrigendums and amendments are bought separately.

Language English

Services Read Online (No printing ) kr 1 835,00 Printed and bound Delivery time: 5-10 days kr 2 294,00

There are no extended editions available for this standard

There are no available corrigendum or amendments for this standard. Any future corrigendum and amendments will be added automatically for subscribers.

Abstract

Aims at identifying the classification level of nonhermetic solid state Surface Mount Devices (SMDs) that are sensitive to moisture-induced stress so that they can be properly packaged, stored and handled to avoid subsequent thermal/mechanical damage during the assembly solder reflow attachment and/or repair operation.

Document information

Standard from IEC
Published: 28 November 2000
Withdrawn: 31 January 2002
Edition: 1
Version: 1
Document type: PAS
Pages
ISBN: 2831854687

ICS 31.080.01
ISO TC TC 47

Product Relations

Adopted by: NEK ISO/IEC 15961-1:2013

IEC PAS 62190:2000 ED1

Access to standards for the entire organization

Benefits of our business solution:

Contact us today for a non-binding offer

Abstract

Document information

Product Relations

Product life cycle

Access to standards for the entire organization

Benefits of our business solution:

Contact us today for a non-binding offer

Extended editions Extended editions (0)

Version history Related corrigendum and amendments (0)

Abstract

Document information

Product Relations

Product life cycle