Standard

IEC PAS 62050:2004 ED1

Nov 2004 Replaced

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Language English

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Abstract

The Board Level Drop Test Method is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize the test board and test methodology to provide a reproducible assessment of the drop test performance of surface mounted components while duplicating the failure modes normally observed during product level test. The purpose of this document is to prescribe a standardized test method and reporting procedure.

Document information

Standard from IEC
Published: 10 November 2004
Withdrawn: 30 January 2008
Edition: 1
Version: 1
Document type: PAS
ISBN: 2831877105

ICS 31.080.01
ISO TC TC 47

Product Relations

Replaced by: IEC 60749-37:2008 ED1

Product life cycle

Current product

Replaced

IEC PAS 62050:2004 ED1
Stage 99.60
Replaced by

Revised

IEC 60749-37:2008 ED1

IEC PAS 62050:2004 ED1

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Abstract

Document information

Product Relations

Product life cycle

Access to standards for the entire organization

Benefits of our business solution:

Contact us today for a non-binding offer

Extended editions Extended editions (0)

Version history Related corrigendum and amendments (0)

Abstract

Document information

Product Relations

Product life cycle