Standard

IEC 63011-2:2018 ED1

Nov 2018 Published

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Abstract

IEC 63011-2:2018 provides specifications of initial alignment and alignment maintenance between multiple stacked integrated circuits during the die bonding process. These specifications define the alignment keys and operating procedures of the keys. These specifications apply only if electrical coupling method of die-to-die alignment is used in the die stacking.

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Standard from IEC
Published: 28 November 2018
Edition: 1
Version: 1
Document type: IS
ISBN:

ICS 31.200
ISO TC TC 47/SC 47A

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Adopted by: NEK IEC 60051-1:1997
FRANKFURT AGREEMENT: prEN 63011-2:2017

IEC 63011-2:2018 ED1

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Abstract

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