Standard

IEC 62878-1:2019 ED1

Oct 2019 Published

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Language English English/French

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Abstract

IEC 62878-1:2019 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3. This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components. The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.

Document information

Standard from IEC
Published: 14 October 2019
Edition: 1
Version: 1
Document type: IS
Pages
ISBN: 9782832274606

ICS 31.180
ICS 31.190
ISO TC TC 91

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Adopted by: NEK IEC 60700-1:2015 RLV
Adopted by: NEK IEC 61280-1-1:1998
FRANKFURT AGREEMENT: FprEN IEC 62878-1:2019

IEC 62878-1:2019 ED1

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Abstract

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