Standard

IEC 61188-1-2:1998 ED1

Apr 1998 Withdrawn

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Abstract

The aim in packaging is to transfer a signal from one device to one or more other devices through a conductor. High-speed designs are defined as designs in which the interconnecting properties affect circuit performance and require unique considerations.

Document information

Standard from IEC
Published: 29 April 1998
Withdrawn: 25 September 2020
Edition: 1
Version: 1
Document type: IS
ISBN:

ICS 31.180
ISO TC TC 91

Product Relations

Adopted by: NEK IEC 62671:2013

IEC 61188-1-2:1998 ED1

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Abstract

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Abstract

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