Shopping cart 0
Redline

IEC 60749-5:2023 RLV

Published

Note: This standard has a new edition: IEC 60749-5:2023 ED3

Preview

Corrigendums and amendments are bought separately.

Language
Services

Abstract

IEC 60749-5:2023 RLV contains both the official IEC International Standard and its Redline version. The Redline version is available in English only and provides you with a quick and easy way to compare all the changes between the official IEC Standard and its previous edition. IEC 60749-5:2023 provides a steady-state temperature and humidity bias life test to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments. This test method is considered destructive. This edition includes the following significant technical changes with respect to the previous edition: a) The specification of the test equipment is changed to require the need to minimize relative humidity gradients and maximize air flow between semiconductor devices under test; b) The specification of the test equipment fixtures is changed to require the avoidance of condensation on devices under test and on electrical fixtures connecting the devices to the test equipment; c) replacement of references to “virtual junction” with “die”.

Document information

  • Redline from IEC
  • Published:
  • Edition: 3
  • Version: 1
  • Document type: IS
  • Pages
  • ICS 31.080.01
  • ISO TC TC 47

Product Relations

Product life cycle