Standard

IEC 60748-20-1:1994 ED1

Mar 1994 Published

Corrigenda and amendments are bought separately.

Language English/French

Services Read Online (No printing ) kr 3 040,00 Printed and bound Delivery time: 5-10 days kr 3 800,00

There are no extended editions available for this standard

There are no available corrigendum or amendments for this standard. Any future corrigendum and amendments will be added automatically for subscribers.

Abstract

The purpose of these examinations is to check the internal materials, construction and workmanship of film and hybrid integrated circuits (F and HFICs). These examinations will normally be used prior to tapping or encapsulation to detect and eliminate the F and HFICs with internal defects that could lead to device failure in normal application. Other acceptance criteria may be agreed upon with the purchaser or supplier, respectively.

Document information

Standard from IEC
Published: 1 March 1994
Edition: 1
Version: 1
Document type: IS
ISBN: 2831829380

ICS 31.200
ISO TC TC 47/SC 47A

Product Relations

Corrects: NEK IEC TS 61464:1998

IEC 60748-20-1:1994 ED1

Access to standards for the entire organization

Benefits of our business solution:

Contact us today for a non-binding offer

Abstract

Document information

Product Relations

Access to standards for the entire organization

Benefits of our business solution:

Contact us today for a non-binding offer

Extended editions Extended editions (0)

Version history Related corrigendum and amendments (0)

Abstract

Document information

Product Relations